For emitters & electronics the temperature is rising
نویسندگان
چکیده
منابع مشابه
High Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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15 صفحه اولPackaging Technologies for High Temperature Electronics and Sensors
This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...
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ژورنال
عنوان ژورنال: III-Vs Review
سال: 1996
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(96)80181-5